作者:MG Bevan · 1999 · 被引用次数:5 — Although not always distinct, electronic packaging may be separated into three levels: component, board, and system. The manufacturing technologies and designs...12 页
The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of...
Application areas include single-chip and multichip packaging, board and substrate structures, die. (substrate) attachment and electrical interconnection, cir-.17 页
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