2024年2月27日 — Common IC package types include DIP, SOP, QFP, and BGA. Each type has distinct characteristics, advantages, limitations, and applications. DIP...
Semiconductor packaging materials play an important role in protecting IC chips from the surrounding environment, ensuring electrical connection for chip...
2024年5月20日 — Advanced Packaging Shakes Up the Value Chain. Advanced packaging accounts for about 8% of the total semiconductor market today and is projected...
2023年10月12日 — PIP, Package in Package, it is actually a form of stacked package, and a package is packaged with another chip or passive device to form a new...
The package is the container that holds the semiconductor die. The packaging may be done by a separate vendor, the OSAT, although foundries are expanding their...
After receiving the product, we were very satisfied, got to know your company better, and found that you always adhere to the corporate philosophy of good faith, and we appreciate this attitude.
This manufacturers not only respected our choice and requirements, but also gave us a lot of good suggestions, ultimately, we successfully completed the procurement tasks.
we were very satisfied, got to know your company better, and found that you always adhere to the corporate philosophy of good faith, and we appreciate this attitude.
This company continuously trains its employees, accumulates product production experience, continuously carries out technological innovation, and can really provide customers with excellent products.