2021年4月27日 — Among the substrates available, there are films made from different types of plastic, paper and aluminium that can be blended to improve...
Our packaging technologies range from packaging resins and sealants to anti-counterfeit solutions, non-woven substrates, and grease-resistant coatings. Key...
ASE's substrate design and manufacturing capability enables the interconnection materials of a wide range of wire-bond BGA and flip chip product applications.
Product variety is complete, good quality and inexpensive, the delivery is fast and transport is security, very good, we are happy to cooperate with a reputable company!